During 16^th – 19^th of March TehnoWorld’s team participated at Moldexpo which took place in Chisinau, the capital of Republic of Moldova. This fair has given us the chance to strengthen the existing relationships with our partners from Republic of Moldova but also to initiate new partnerships with potential customers. Our products ( hyperlink to Aplicatii) represented a real interest from the visitor’s point of view therefore our participation to the fair was a success.